C12000 Oxygen-Free Copper

C12000 Oxygen-Free Copper

>99.9% Cu
PURITY
85-90%IACS
CONDUCTIVITY
H00-H04
TEMPER
C12000 Copper, also known as DLP (Low Phosphorus Deoxidized) copper, is a phosphorus-deoxidized copper grade with good weldability and reliable thermal conductivity. It is commonly used in heat exchangers, plumbing systems, and industrial applications requiring good fabrication performance.
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Lead Time: 3-5 Business Days

Product Overview

C12000 copper, commonly referred to as DLP copper, is a low-phosphorus deoxidized copper grade containing high copper purity and controlled phosphorus content. It is manufactured to ASTM B152 and related standards for applications requiring good thermal conductivity and improved fabrication performance.

Produced through deoxidation processes that reduce residual oxygen content, C12000 copper provides excellent welding and brazing characteristics with reduced risk of hydrogen embrittlement. Its balanced mechanical strength and reliable corrosion resistance make it suitable for various industrial and thermal systems.

C12000 copper is widely used in plumbing equipment, heat exchangers, and industrial piping systems where consistent performance and good formability are required. It is commonly applied across HVAC, power generation, and general engineering industries.

Key Features

High purity copper (≥99.9% Cu)
Extremely low oxygen content (≤0.0005%)
Excellent electrical conductivity (101% IACS)
Superior thermal conductivity
High ductility and formability
Suitable for various fabrication processes

Available Sizes

Copper Shape Thickness (mm) Width/Diameter (mm) Length (m)
Bar - Φ5-200 1-6
Wire - Φ0.05-10 Customize
Sheet 0.25-6 500-2500 1-6
Plate 6-200 200-3000 1-6
Strip 0.15-6 8-610 Customize
Tube OD: φ2-600; WT:φ0.2-100mm - 1-6
Coil 0.15-6 3-1250 1-6
Foil < 0.15 10-1350 Customize
Profile Customized Customize Customize

* Custom sizes available upon request. Contact our sales team for special requirements.

Technical Specifications

Precision data for engineering decisions. All values tested per ASTM standards.

01 Chemical Composition

Element Value (%)
Cu ≥ 99.90
P 0.004–0.012
O ≤ 0.01
Pb ≤ 0.005
Fe ≤ 0.005

02 Mechanical Properties

Property Condition Value
Tensile Strength H00 200–260 MPa
Yield Strength H00 70–120 MPa
Elongation H00 ≥ 35%
Hardness (HRB) H00 45–60

03 Physical Properties

Property Value
Density 8.89 g/cm³
Electrical Conductivity 85–90% IACS
Thermal Conductivity 340 W/m·K
Melting Point 1083°C
Thermal Expansion 17.0 ×10⁻⁶ /K

Applications & Use Cases

Proven solutions across diverse industries. From aerospace to marine environments.

C12000 Deoxidized Low-Phosphorus (DLP) Copper — FAQ

Practical FAQ on C12000 DLP copper, ASTM specs, properties and how it differs from DHP C12200.

C12000 is phosphorus-deoxidized copper with Cu ≥99.90% and a low phosphorus content of 0.004–0.012%. The small phosphorus removes oxygen, making it weld- and braze-friendly while keeping good conductivity.
ASTM B152 (sheet/strip/plate), B124 (forging rod) and B280 (ACR tube) cover C12000; it is supplied as sheet, strip, rod and tube.
Conductivity is in the high-80s to mid-90s % IACS (slightly below ETP due to phosphorus), with annealed UTS ~195–250 MPa and elongation ~35–45%. It is not susceptible to hydrogen embrittlement.
Both are phosphorus-deoxidized. C12000 has the lower phosphorus (0.004–0.012%) and slightly higher conductivity, while C12200 (DHP) has 0.015–0.040% phosphorus and is the standard for plumbing/HVAC tube and brazed assemblies. Choose C12000 when you want a bit more conductivity; choose C12200 for tube and brazing.
Linsy supplies C12000 to ASTM with an MTR/MTC, SGS on request, and RoHS/REACH support. Typical lead time is 10–60 days with low MOQ and a 1-hour quoting response.
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